Low pressure molding Hot melt polyamide adhesive LPM 1025B

Specifications

When substrates with high heat conductivity shall be bonded the use of a given application temperature is necessary for good wetting. The substrate surface should be free of dust and cleaned with a suitable solvent so that there is no fat and oil.

Do not heat the product over the mentioned application temperature range. Without using do not heat the product for a long time, because the quality can decrease or extremely the product cokes. The standby temperature is 80 °C.

LMP 1025B may adsorb moisture from the air. This will not be obvious in the solid form, but could cause foaming as the adhesive is melted which may result in poor bonds. Re close the container tightly as soon as sufficient adhesive has been removed for immediate use.

OTHER TIPS

Apparatus cleaning: Remove very strong coked and not thermoplastic rests of hot melt mechanically.

Safey precautions: No health hazards are expected when this product is in solid form. However, once melted it is like any hot liquid, which can produce severe burns. The appropriate safety precautions should be used (see also safety- data-sheet). If the molten adhesive has contacted your skin, cool the affected area immediately with cold water. Do not try to remove the adhesive from the skin. Go to your first aid station for attention.

LPM has the application systems for hot melt adhesive.

PACKAGING

From of supply: Granulate, store in 25 kg net weight bag.
storage: Up to max. +35 °C, min. 12 months in original closed container. Be sure that used container are closed immediately with insulation against moisture. Maybe the adhesive and application properties can decrease by storing with open containers.